Multilayer UV-Curable Adhesive Film 

United States Patent Application  20110018127

This invention is an adhesive film comprising (a) a top layer that is substantially UV curable and that has a glass transition temperature of 50.degree. C. or less; and (b) a bottom layer that is substantially not UV-curable. Additional embodiments include a bundled wafer lamination film, a semiconductor wafer with a multilayer adhesive film attached, a process for attaching a semiconductor die to a substrate, and a method of preventing individually diced dies from sticking to one another.