Westmoreland, NH -- Polyonics XF-537 is a laser markable label material (LML) that represents the next generation label technology for high temperature and harsh environment applications. XF-537 includes a polyimide film with a durable, antistatic, cross linked polymer top coat that can be easily ablated with a wide variety of CO2, YAG, UV, Vanadate or Fiber Diode lasers. The unique LML material allows the ablation process to produce crisp 2D and linear bar codes and alphanumeric characters. It also eliminates ink, long the weak link in traditional thermal transfer printed labels. Together, XF-537 provides greater chemical resilience, longer term durability and improved readability especially in high temperature and harsh environment applications.
Added Value for Direct Laser Marked Parts
Polyonics XF-537 is designed to address direct part marking system (DPM) issues and help lower manufacturing costs. LML materials improve read rates of DPMs by increasing bar code contrast. They also allow manufacturers to capture QC and test data by directly marking the labels in process. In addition, using LML materials in concert with DPMs helps simplify the rework process by allowing tracking, retesting and relabeling rejected and/or reworked parts.
The XF-537 is an antistatic LML material. It has a surface resistance of 10∧5 to 10∧9 Ohms allowing it to safely dissipate triboelectric charges before they can build up and cause a potentially harmful ESD event. The Polyonics XF-537 also has a low peel voltage (<100v) when its liner is removed further protecting static sensitive components and devices.
High Temperature Alternative to PET and Acrylic Label Materials
Polyimide is the material of choice for applications involving extreme temperatures and direct exposure to harsh chemicals. XF-537 provides far superior durability and thermal stability than the polyester (PET) label materials on the market. Now with the Polyonics polyimide LMLs, manufacturers can dramatically improve the long term durability of their labeling in the harshest of applications including,
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