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Master Bond推出一款電子應用2C環氧樹脂導熱填料EP48TC

來源：本站原創2015年04月09日

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Master Bond Unveils EP48TC, a 2C Epoxy Featuring Thermal Conductive Fillers for Electronics and more

Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K.m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20-25 BTU.in/ft2.hr.F [2.88-3.60 W/(m.K)]. It can be used in applications in the aerospace, electronic, optical, specialty OEM and many other high-tech industries.

EP48TC has a tensile lap shear strength ranging from 900-1,100 psi and bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many plastics. Even in thin sections, its strength retention is outstanding. It also has a low coefficient of thermal expansion, low shrinkage upon curing and excellent dimensional stability.

EP48TC has a forgiving 100 to 40 mix ratio by weight, or 100 to 50 mix ratio by volume. The working life for a 100 gram batch at 75F is 90-120 minutes. The epoxy cures at room temperature or more quickly at elevated temperatures. It is serviceable over the temperature range of -100F to +300F. The color of Parts A and B is gray. EP48TC is available in standard packaging ranging from pint to 5 gallon container kits.

About Master Bond
Master Bond Inc. formulates the highest quality products and offers unmatched technical advice and customer support. Its product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. The company offers replacements for competitors discontinued products.