新產品·新技術信息

亨斯曼在Ligna上突出其最新的復合木材粘接技術

來源：本站原創2015年05月12日

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Huntsman at Ligna: Highlights its Latest Composite Wood Bonding Technologies

Everberg, Belgium ? Huntsman, a leading supplier of methylene diphenyl diisocyanate (MDI)-based resins and release agents, is exhibiting at the Ligna World Fair at Hannover Messe, Germany from 11 to 15 May 2015.

Ligna is one of the world’s premier trade events for the woodworking industry. Technical experts from the polyurethanes Composite Wood Products (CWP) team at Huntsman is on hand in Hannover to discuss MDI and its applications, which include oriented strand board (OSB) multi-density fiberboard (MDF) particleboard (PB) and wood fiber insulation board (WFIB) manufacture.

During Ligna, Huntsman is highlighting the latest binding technologies available in its successful portfolio of I-BOND resin and I-RELEASE systems. Commercial representatives from Huntsman’s Asian, North American and European polyurethanes teams are also available to discuss the specific needs of wood panel manufacturers around the world alongside detailed cost models.

Bart Singule, Commercial Manager for CWP in Europe, Africa, India and the Middle East (EAIME) said: “We’ve exhibited at Ligna for many years and over time have seen interest in MDI rise steadily. This is unsurprising when you consider the far-reaching benefits of the technology. No-added formaldehyde solutions, improved performance and reduced costs per m3, make MDI an increasingly popular choice.

“With a global supply chain, it’s little wonder that Huntsman has become the adhesive partner of choice for the composite wood panel industry. Ligna is a key milestone in our diary and in the calendar of every composite wood panel producer. For us, it’s an important opportunity to meet new and existing custom ers in person and discus