3M Develops Pressure Sensitive Cover Tape 2698, a Transparent Polyester Film Tape
ST. PAUL, Minn -- Ever-shrinking electronic component sizes, driven by wafer-level chip scale packaging, demand that circuit board manufacturers deliver performance, speed and reliability in these advanced and ultra-small packages. A new generation of cover tape from 3M enables near-flawless placement of today’s shrinking chips on circuit boards without sticking, static charge or contamination. Combined with longer reels, 3M Pressure-Sensitive Cover Tape 2698 helps to eliminate pick-and-place errors, minimize down-time and increase productivity ? all at no greater cost than other tape. Wafer-level chip scale packages and other electronic components are embedded into circuit boards at high-speed using a stamping machine that picks up components from reels of carrier tape and stamps them onto each board. The thinner, lighter nature of these packages can lead to unit stick. As components continue to become smaller, only the highest quality tape can ensure accurate feeding, picking and placement. 3M Pressure-Sensitive Cover Tape 2698 is a transparent, polyester film tape with synthetic, room-temperature, pressure-sensitive adhesive zones at its sides. It is available in standard widths and 600 m-long reels designed to reduce changeover time and enable productivity improvements. It will work in existing industry-standard equipment. Benefits include:
相關(guān)閱讀
本站所有信息與內(nèi)容，版權(quán)歸原作者所有。網(wǎng)站中部分新聞、文章來源于網(wǎng)絡(luò)或會員供稿，如讀者對作品版權(quán)有疑議，請及時(shí)與我們聯(lián)系，電話：025-85303363 QQ：2402955403。文章僅代表作者本人的觀點(diǎn)，與本網(wǎng)站立場無關(guān)。轉(zhuǎn)載本站的內(nèi)容，請務(wù)必注明"來源：林中祥膠粘劑技術(shù)信息網(wǎng)（www.www.proactivelibertylake.com）".
網(wǎng)友評論
加載中...
