LIQUID EPOXY RESIN COMPOSITION AND ADHESIVE AGENT FOR HEATSINK AND STIFFENER 

美國專利申請號Application number：US201514819797

Abstract：Provided is a highly reliable adhesive agent for heatsink or stiffener, obtained by improving a conventional epoxy resin composition. The invention is a liquid epoxy resin composition exhibiting a viscosity of 50 to 1,000 Pas when measured by an E-type viscometer at 25 DEG C., and including a liquid epoxy resin exhibiting a viscosity of 0.1 to 1,000 Pas when measured as above; a liquid phenol-based curing agent without siloxane bond and exhibiting a viscosity of 0.1 to 100 Pas when measured as above; a curing accelerator selected from tetraphenylphosphine, imidazole and tertiary amine; an inorganic filler treated with a silane coupling agent and exhibiting an average particle diameter of 0.1 [mu]m or larger; thermoplastic resin particles being solid at 25 DEG C.; and a silica treated with a silane coupling agent having a nonreactive functional group, and exhibiting an average particle diameter of not smaller than 0.005 [mu]m but smaller than 0.1 [mu]m.

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